| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling plate that is applied to a cooling device for a semiconductor in which a cooling liquid is circulated and can lower a maximum temperature by making the temperature of a surface thereof more uniform so as to have high cooling performance, and the cooling device.SOLUTION: A cooling plate 100 provided with a flow passage for circulating a cooling liquid inside includes a partition wall 106, a partition wall 102, and a partition wall 104. The flow passage includes at least a pair of an outgoing path 110 and a return path 112, which are provided adjacently across the partition wall 106. A heat conduction acceleration part 108 is provided on a partition wall surface 114 of the partition wall 106 on the side of the outgoing path 110, and a heat conduction acceleration part 108 is provided on a partition wall surface 116 of the partition wall 106 on the side of the return path 112, the heat conduction acceleration part 108 on the side of the outgoing path 110 and the heat conduction acceleration part 108 on the side of the return path 112 being arranged alternately based upon a direction parallel with the circulation direction of the cooling fluid. |
