| 摘要 |
<p>Disclosed is a semiconductor package of a PoP shape capable of forming a fine pitch. The semiconductor package according to the present invention includes a lower printed circuit board in which one or more lower semiconductor chips are attached on the upper surface; an upper printed circuit board arranged on the lower printed circuit board and in which one or more upper semiconductor chips are attached on the upper surface; a lower mold layer formed on the upper surface of the lower printed circuit board to be arranged between the lower printed circuit board and the upper printed circuit board; a first partial space formed in the lower mold layer; a second partial space formed in the first partial space; a via hole penetrating the lower mold layer; and a solder layer electrically connecting the upper printed circuit board and the lower printed circuit board and penetrating the via hole. A horizontal cross section of the first partial space is changed according to the whole height of the first partial space, and the lowermost horizontal cross section of the second partial space is gradually reduced from the upper surface of the lower mold layer to the inside of the lower mold layer.</p> |
