| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a copper fine particle by which a copper fine particle having an average particle size of 1 μm or less and also a good dispersibility can be stably produced without regard to the particle size of raw material, and to provide conductive paste employing the copper fine particle obtained by the method, and a method for producing conductive paste.SOLUTION: The method for producing a copper fine particle includes a step of reacting a copper source containing a monovalent copper compound with an acid in water, hydrophilic solvent or mixed solvent comprising them. The reaction step includes a step of dissolving the monovalent copper compound into the acid and a step of depositing copper fine particle as a result of reaction of the monovalent copper compound dissolved in the acid, and during the deposition step of the copper fine particle, halogen ion and a water-soluble polymer are caused to be present in the solvent. |
