| 摘要 |
PROBLEM TO BE SOLVED: To realize a shield case which achieves large design flexibility and has a heat radiation effect.SOLUTION: A shield case 10 is used for shielding a circuit board 3 on which an integrated circuit 2 is mounted. The shield case 10 uses a conductive film formed by bonding a metal foil 14 to a resin film 15 and includes a cover part 11, a heat absorption part 13, and a ground part 12. The cover part 11 has a shape that covers the circuit board 3, and the heat absorption part 13 is formed by disposing a part of the metal foil 14 on the integrated circuit 2. The ground part 12 is formed by placing another part of the metal foil 14, which is different from the heat absorption part 13, in contact with a ground of the circuit board 3. |
