| 摘要 |
Required are a method and system for minimizing damage to a processing substrate in a processing substrate transfer step even though a thin processing substrate is used. A substrate bonding system according to the present invention for solving a problem forms a bonding substrate by bonding the processing substrate to a transfer substrate to prevent damage to the processing substrate in the processing substrate transfer step. The substrate bonding system includes a processing substrate input unit on which the processing substrate and the transfer substrate inputted from the outside are loaded, a bonding unit which bonds the processing substrate to the transfer substrate in a vacuum exhaustion state, and a transfer unit which transfers the processing substrate and the transfer substrate from the processing substrate input unit to the bonding unit. [Reference numerals] (111) First loader; (112) Cutting unit; (113) Cleaning unit; (114) First unloader; (115) Second unloader; (121) First transfer unit; (122) Reverse unit; (123) Second transfer unit; (124) Bonding unit; (125) Third unloader; (130) Inspecting unit |
