| 摘要 |
PROBLEM TO BE SOLVED: To achieve single-wafer processing of substrates easily in a sealed space.SOLUTION: A substrate processing apparatus 1 comprises: a substrate holding section 2; a substrate rotation mechanism 5; and a chamber 7. The substrate rotation mechanism 5 comprises: an annular rotor 52 arranged in the internal space 70 of the chamber 7; and a stator 51 arranged around the rotor 52 on the outside of the chamber 7. The substrate holding section 2 is attached to the rotor 52 in the internal space 70 of the chamber 7. In the substrate rotation mechanism 5, a torque around the central axis J1 is generated. Consequently, the rotor 52 rotates around the central axis J1, in floating state, together with a substrate 9 and the substrate holding section 2. In the substrate processing apparatus 1, the substrate 9 can be rotated easily in the internal space 70 having high sealing performance. As a result, single-wafer processing of the substrates 9 can be achieved easily in a sealed internal space 70. |
