| 摘要 |
The object of the invention is to provide a wiring board having the uniform quality at a high yield which is produced by hot-pressing and laminating on a wiring board base material a thermotropic liquid crystal polymer which is excellent as a wiring board covering material. The present invention provides a method of making a wiring board comprising: hot-pressing and laminating a thermotropic liquid crystal polymer film on a wiring board base material on the surface of which at least one layer containing a electro-conductive circuit is exposed, characterized by that a viscoelastic characteristic of the thermotropic liquid crystal polymer film is measured at a low frequency within a laminating temperature region and the hot-pressing is carried out at a temperature selected so that the viscoelastic characteristic falls within a predetermined range. |
