LASER CUTTING APPARATUS AND METHOD FOR FILM ATTACHED TO GLASS SUBSTRATE

摘要

The present invention relates to a laser cutting apparatus for a film attached glass substrate which comprises: a stage in which a glass substrate in which a film is attached to one side is placed; a scribing unit for forming scribing lines on the other surface of the glass substrate to which the film is not attached; a laser unit which is arranged to be faced with the scribing unit and irradiates one side of the glass substrate with laser along the scribing line; a transfer unit which transfers the scribing unit and the laser unit; and a control unit for controlling the actions of the transfer unit. In the stage, a laser cutting device for the film attached glass substrate in which an opening is formed in a region corresponding to the scribing line is provided.