| 摘要 |
According to the present invention, a granule bonding type biofilm carrier has granules (21) bonded by using an organic or inorganic bond (22). The bonded granules are formed with pores (23) to have porosity, and the bond is added with a filament (24) which has a high tensile strength, in order for the granules not to be easily disintegrated but to strongly bond together. |
