| 摘要 |
A light emitting device package, a sub mount and a manufacturing method thereof are provided to supply a sub mount and package having a short protection groove that surrounds a back electrode, thereby preventing a fault. A bathtub unit(120) and a through hole(150) in which a light emitting device(200) will be mounted are formed on a silicon substrate(110) through bulk-etching. A short protection groove(140) having a height(h) and predetermined distance(w) from a back electrode(131) is formed. Therefore, blurred solder or epoxy is not contacted with a substrate surface exposed by a cutting work. The short protection groove has a form of surrounding the back electrode. The predetermined distance height from the back electrode are respectively 50 to 500 micro meter. |
