发明名称 OPTICAL SEMICONDUCTOR ENCAPSULATING MATERIAL
摘要 The present invention provides a sealant material for an optical semiconductor containing (A) one or more kinds of a (meth)acrylic compound selected from a (meth)acrylate-modified silicone oil, a long chain alkyl (meth)acrylate, and a polylakylene glycol (meth)acrylate having the number average molecular weight of 400 or more, (B) a (meth)acrylate compound having an ester bond with an alicyclic hydrocarbon group having 6 or more carbon atoms, and (C) a radical polymerization initiator; and an optoelectronic conversion element and an optoelectronic conversion device using thereof. The sealant material for an optical semiconductor of the present invention provides a cured product having excellent characteristics in transparency, stability to UV light and heat, yellowing resistance, and adhesion performance, and thus may be suitably used as a sealant material for a light emitting element, a light receiving element and the like in an optical semiconductor device (semiconductor light emitting device), especially as a transparent sealant material for optical semiconductors such as LED and the like.
申请公布号 KR101365834(B1) 申请公布日期 2014.02.21
申请号 KR20087026599 申请日期 2007.04.19
申请人 发明人
分类号 C08F220/10;C08F220/18;C08L33/14;H01L31/02;H01L33/56 主分类号 C08F220/10
代理机构 代理人
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