| 摘要 |
A method for preparing a flexible laminated plate is provided to reduce the heating time, to improve bending property and dimensional stability and to reduce tensile modulus. A method for preparing a flexible laminated plate comprises the steps of coating a polyimide precursor resin solution on a conductive metal plate; and heating it to dry and cure the polyimide precursor resin solution, wherein the heating time at a temperature of 90 deg.C or more is within 5-25 min, the ratio of the heating time at a temperature of 90-200 deg.C and the heating time at a temperature above 200 deg.C is 9:1 to 7:3, and the formed polyimide resin layer has a tensile modulus of 3-6 GPa and a coefficient of thermal expansion of 16-28 ppm/deg.C. |
