| 摘要 |
<p>A multi-chip module power clip (200) includes an integrated circuit (IC,150) capsulated in a resin (250), a dual n-channel MOSFET(110), leads (210,211,212), gate leads (213,213), source leads (217-220). The IC (150) and the dual n-channel MOSFET(110) are mounted on the leads. The IC leads (210,211,212) are made of flat metals. The leads are respectively connected to electrodes such as a TEST, a VDD, and a VM on the IC (150) by using a flip chip technique for assembling the leads with Cu fillers or Cu studs.</p> |
