发明名称 COVER TAPE FOR PACKAGING ELECTRONIC PART AND ELECTRONIC PART PACKAGE
摘要 The object of the present invention is to provide a cover tape for electronic part packaging that is more difficult to take on electrostatic charge and has excellent transparency, and to provide a package for an electronic part. A cover tape (100) relating to the present invention includes a plurality of layers including at least a base layer (110) and a heat seal layer (140). At least two layers of these plurality of layers are laminated with an adhesive layer (120) interposed. The adhesive layer (120) contains an antistatic agent in an amount that makes up 10 wt % or more and 70 wt % or less of the adhesive layer (120). The antistatic agent contains an alkylene carbonate and a surfactant as the primary components.
申请公布号 HK1165771(A1) 申请公布日期 2014.02.21
申请号 HK20120106583 申请日期 2012.07.05
申请人 SUMITOMO BAKELITE CO. LTD. 发明人 HIRAMATSU, MASAYUKI
分类号 B65D;B32B 主分类号 B65D
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