| 摘要 |
PROBLEM TO BE SOLVED: To provide a novel one-pack epoxy resin composition exhibiting a high adhesiveness even against a substrate such as LCP, etc., excellent in terms of serviceable time at room temperature, and also favorable in terms of workability; and a composite member and an electronic component device adhered and sealed by using the same.SOLUTION: The provided composition includes, as indispensable components, an epoxy resin liquid at normal temperature, a curative, and an inorganic filler; in the epoxy resin, amino glycidyl ether accounts for at least 20 mass% of the entire epoxy resin, phenolic curative having alkenyl groups accounts for at least 30 mass% of the entire curative, and a thiol compound having a triazine skeleton is mixed within a ratio range of 0.1-5 mass% with respect to the entire quantity of the epoxy resin composition. |
