发明名称 METHOD FOR FABRICATING ONE-DIMENSIONAL METALLIC NANOSTRUCTURES
摘要 A method for fabricating one-dimensional metallic nanostructures comprises steps: sputtering a conductive film on a flexible substrate to form a conductive substrate; placing the conductive substrate in an electrolytic solution, and undertaking electrochemical deposition to form one-dimensional metallic nanostructures corresponding to the conductive film on the conductive substrate. The method fabricates high-surface-area one-dimensional metallic nanostructures on a flexible substrate, exempted from the high price of the photolithographic method, the complicated process of the hard template method, the varied characteristic and non-uniform coating of the seed-mediated growth method.
申请公布号 US2014048420(A1) 申请公布日期 2014.02.20
申请号 US201213660796 申请日期 2012.10.25
申请人 NATIONAL CHIAO TUNG UNIVERSITY 发明人 CHEN YU-LIANG;CHIEN NAI-YING;CHIU HSIN-TIEN;LEE CHI-YOUNG
分类号 C23C28/02;B82Y40/00;B82Y99/00;C25D5/54;C25D5/56;C25D7/12 主分类号 C23C28/02
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