发明名称 |
METHOD FOR FABRICATING ONE-DIMENSIONAL METALLIC NANOSTRUCTURES |
摘要 |
A method for fabricating one-dimensional metallic nanostructures comprises steps: sputtering a conductive film on a flexible substrate to form a conductive substrate; placing the conductive substrate in an electrolytic solution, and undertaking electrochemical deposition to form one-dimensional metallic nanostructures corresponding to the conductive film on the conductive substrate. The method fabricates high-surface-area one-dimensional metallic nanostructures on a flexible substrate, exempted from the high price of the photolithographic method, the complicated process of the hard template method, the varied characteristic and non-uniform coating of the seed-mediated growth method. |
申请公布号 |
US2014048420(A1) |
申请公布日期 |
2014.02.20 |
申请号 |
US201213660796 |
申请日期 |
2012.10.25 |
申请人 |
NATIONAL CHIAO TUNG UNIVERSITY |
发明人 |
CHEN YU-LIANG;CHIEN NAI-YING;CHIU HSIN-TIEN;LEE CHI-YOUNG |
分类号 |
C23C28/02;B82Y40/00;B82Y99/00;C25D5/54;C25D5/56;C25D7/12 |
主分类号 |
C23C28/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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