| 摘要 |
The present invention has been aimed to propose a process and a device of fabricating a prepreg for a printed circuit board which are capable of controlling respective thicknesses of resin layers on the opposite surfaces of a resultant prepreg, removing air bubbles from the resultant prepreg, and improving productivity. The present invention is a process of resin-coating the opposite surfaces of an elongated substrate sheet 3. The process includes the steps of: feeding the substrate sheet 3 while tensioning the same in a feeding direction along the length of the substrate sheet 3; coating, by the coating head 2 of the first dispenser 1a, one surface of the substrate sheet 3 with the fluid resin 4 while pressing against the one surface to bend the substrate sheet 3; and subsequently coating, by the coating head 2 of the second dispenser 1b, the other surface of the substrate sheet 3 with the fluid resin 4 while pressing against the other surface to bend the substrate sheet 3. A die coater and a roll coater can be used as the first dispenser 1a and the second dispenser 1b. |
