发明名称 SIC COMPACT AND METHOD FOR MANUFACTURING SIC COMPACT
摘要 PROBLEM TO BE SOLVED: To provide a CVD-SiC compact which has low light permeability and high electrical resistivity and can be favorably used for an etcher member and so on used in a semiconductor manufacturing process.SOLUTION: An SiC compact, formed by the CVD method, includes boron atoms by 1-30 mass ppm, and nitrogen atoms by more than 100 mass ppm and equal to or less than 1000 mass ppm. Preferably, electrical resistivity is more than 10 &OHgr; cm and equal to or less than 100000 &OHgr; cm, and light permeability is 0-1% at a wavelength of 950 nm.
申请公布号 JP2014031527(A) 申请公布日期 2014.02.20
申请号 JP20120171002 申请日期 2012.08.01
申请人 TOKAI CARBON CO LTD 发明人 SUGIHARA TAKAOMI;ASAKURA MASAAKI;TOKUNAGA TAKESHI;SADAKI TETSUYA
分类号 C23C16/42;H01L21/3065 主分类号 C23C16/42
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