| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for reducing warpage of a wiring board while firing.SOLUTION: A wiring board includes a plurality of ceramic insulation layers, a plurality of wiring layers placed between the plurality of ceramic insulation layers, and a plurality of through conductors formed in the through holes penetrating the ceramic insulation layers in the thickness direction, and connecting the plurality of wiring layers electrically. The through conductors include a plurality of types of different contraction coefficient while firing. When the thickness of the wiring board is divided equally into two in the lamination direction, at least one through conductor of the type of largest contraction coefficient is included in the side of the wiring boards divided equally into two where the total volume of through conductors is smaller. |
