发明名称 JOINING METHOD OF METAL SURFACES AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT MOUNTED BODY USING SAME
摘要 PROBLEM TO BE SOLVED: To facilitate adjustment of the size of a force applied between the metal surface of one member and the metal surface of the other member.SOLUTION: A joining method comprises the steps of: arranging a plurality of spacers to constitute a metal surface of one member; applying joining material paste containing metallic fine particles and solvents to cover the metal surface of one member and the plurality of spacers; arranging the metal surface of the other member and the metal surface of one member to face each other; applying a force to hold the plurality of spacers and the joining material paste between the metal surface of one member and the metal surface of the other member and applying heat at a first temperature lower than that of evaporating the solvents and that of melting the plurality of spacers; applying heat at a second temperature higher than the first temperature of sintering the metallic fine particles; and executing cooling to a temperature lower than the first temperature.
申请公布号 JP2014030829(A) 申请公布日期 2014.02.20
申请号 JP20120170988 申请日期 2012.08.01
申请人 KYOCERA CORP 发明人 MIYAWAKI KIYOSHIGE
分类号 B23K20/00;H01L21/52 主分类号 B23K20/00
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