发明名称 THERMALLY CONDUCTIVE ELECTROMAGNETIC WAVE SHIELD SHEET
摘要 PROBLEM TO BE SOLVED: To provide a thermally conductive electromagnetic wave shield sheet in which shielding of electromagnetic waves and thermal conductivity are enhanced.SOLUTION: A thermally conductive electromagnetic wave shield sheet for dissipating heat generated from an electronic component 15 to a housing 16 while shielding electromagnetic waves entering the electronic component 15 or exiting therefrom includes a conductive layer 13 adhering to the surface of the electronic component, and a heat conduction layer 12 laminated on the conductive layer 13 so as to sandwich the conductive layer 13 therebetween. Since the conductive layer 13 adheres to the surface of the electronic component 15, no gap occurs between the surface of the electronic component 15 and the conductive layer 13, and electromagnetic waves entering the electronic component 15 or exiting therefrom can be shielded surely by the conductive layer 13. Furthermore, since the heat conduction layer 12 has an Asker C hardness of 30 or less, it can be applied tightly to the housing 16 while following the shape thereof, and thereby heat dissipation by the heat conduction layer 12 can be enhanced furthermore.
申请公布号 JP2014033130(A) 申请公布日期 2014.02.20
申请号 JP20120173837 申请日期 2012.08.06
申请人 KITAGAWA IND CO LTD 发明人 UENO KAZUE;SHIONO RYOSUKE
分类号 H05K9/00 主分类号 H05K9/00
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