MANUFACTURING METHOD OF LAMINATION PACKAGE STRUCTURE, ASSEMBLING DEVICE AND MANUFACTURING SYSTEM

摘要

PROBLEM TO BE SOLVED: To manufacture a lamination package structure superior in repairability capable of increasing the resistance against impact due to connection between a lamination package and a circuit board.SOLUTION: The manufacturing method of a lamination package structure includes the steps of: (i) preparing a bottom package including a first semiconductor element, plural terminal electrodes, and an insulation member having plural via holes; (ii) preparing a top package including a second semiconductor element and plural first bumps having first melting point mp1; (iii) applying to the plural first bumps with a first solder powder having a second melting point mp2 lower than the first melting point mp1 and a first paste including a first heat-curing flux that is cured at a temperature lower than the first melting point mp1; (iv) mounting the top package onto the bottom package so that the plural first bumps are received in the corresponding plural via holes being in contact with the corresponding plural terminal electrodes via the first paste.