发明名称 |
MULTI-LEVEL CONTACT TO A 3D MEMORY ARRAY AND METHOD OF MAKING |
摘要 |
A method of making multi-level contacts. The method includes providing an in-process multilevel device including at least one device region and at least one contact region. The contact region includes a plurality of electrically conductive layers configured in a step pattern. The method also includes forming a conformal etch stop layer (122) over the plurality of electrically conductive layers, forming a first electrically insulating layer (124) over the etch stop layer, forming a conformal sacrificial layer (126) over the first electrically insulating layer and forming a second electrically insulating layer (128) over the sacrificial layer. The method also includes etching a plurality of contact openings (130A-E) through the etch stop layer, the first electrically insulating layer, the sacrificial layer and the second electrically insulating layer in the contact region to the plurality of electrically conductive layers. |
申请公布号 |
WO2013176960(A3) |
申请公布日期 |
2014.02.20 |
申请号 |
WO2013US41410 |
申请日期 |
2013.05.16 |
申请人 |
SANDISK TECHNOLOGIES, INC. |
发明人 |
LEE, YAO-SHENG;CHEN, ZHEN;FUKATA, SYO |
分类号 |
H01L21/768;H01L27/115 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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