发明名称 |
METHOD OF MANUFACTURING ENCAPSULATION STRUCTURE FOR ENCAPSULATING LED CHIP |
摘要 |
A method of manufacturing an encapsulation structure for encapsulating an LED chip includes the following steps: providing a first encapsulation defining a receiving room for receiving the LED chip therein and a second encapsulation defining a receiving space for receiving the first encapsulation therein; providing a mounting tablet defining an entrance therein, mounting the first encapsulation and the second encapsulation on the mounting tablet with a clearance defined therebetween communicating with the entrance; injecting a liquid transparent resin with phosphorous compounds disturbed therein into the clearance via the entrance; and solidifying the liquid transparent resin to form a transparent resin layer interconnecting the first encapsulation and the second encapsulation. |
申请公布号 |
US2014051195(A1) |
申请公布日期 |
2014.02.20 |
申请号 |
US201314060623 |
申请日期 |
2013.10.23 |
申请人 |
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. |
发明人 |
CHAN SHIUN-WEI;KE CHIH-HSUN |
分类号 |
H01L33/52 |
主分类号 |
H01L33/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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