发明名称 WIRE COATING MATERIAL PEELING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a wire coating material peeling device having a function capable of detecting the contact of the core wire of a wire with a cutter, and also detecting that of even a short-cut wire.SOLUTION: The wire coating material peeling device includes a signal analysis circuit 74 for measuring, for example, an impedance via cutters 27 and 27, and when the cutters 27 and 27 are brought into contact with a core wire 70 of a wire W in the peeling process of a coating material 71 of the wire W, the change of the impedance due to the addition of an impedance of the core wire 70 to the cutters 27 and 27 is detected. When it is detected that the cutters 27 and 27 are brought into contact with the core wire 70, current leak between a signal line 73 of a shield cable 100 and a shield material 101 side of the shield line 100 is reduced or prevented from occurring by a buffer circuit 103 which applies a signal in the same level as that of an electric signal to the cutters 27 and 27 to the shield material 101 side of the shield cable 100 for transmitting an electric signal to the cutters 27 and 27 or from the cutters 27 and 27.
申请公布号 JP2014033479(A) 申请公布日期 2014.02.20
申请号 JP20120170711 申请日期 2012.08.01
申请人 MCM COSMIC KK 发明人 WU SHU XING;NAKAMURA AKIO
分类号 H02G1/12;B26D3/00 主分类号 H02G1/12
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