COVER TAPE, METHOD FOR MANUFACTURING COVER TAPE AND ELECTRONIC COMPONENT PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a cover tape for packaging an electronic component capable of sufficiently reducing loosening of a cover tape occurring during heat sealing, capable of sufficiently suppressing elongation of a cover tape in peeling from a carrier tape and further capable of sufficiently suppressing a dimensional change of a cover tape before and after heat sealing.SOLUTION: There is provided a cover tape for packaging an electronic component which comprises a base material layer, a seal layer and an intermediate layer provided between the base material layer and the seal layer. The base material layer contains a polypropylene-based resin in a proportion of 50 mass% or more and has at least a rigid layer containing a polyamide-based resin as the intermediate layer, the thermal shrinkage in the width direction is 5% or less at 80°C and 10 to 30% at 130°C, and the yield point load in the length direction is 15 N or more.