| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which is manufactured by an easy method and has low wiring resistance, and to provide a manufacturing method of the wiring board.SOLUTION: A wiring board 101 includes: an insulative base material 9; a first wiring layer 1 formed on one surface of the base material 9; a second wiring layer 2 formed on the other surface of the base material 9; and a conductor 3 electrically connecting the first wiring layer 1 with the second wiring layer 2. The conductor 3 is formed in a hole 9h that penetrates through the base material 9 and does not penetrate through the first wiring layer 1, and the second wiring layer 2 traverses a part of the first wiring layer 1 in a plane view and a perspective view. The first wiring layer 1 includes: a first lower layer conductor 1A which is formed on the base material 9 and contains a binder resin and a conductive member; and a first upper layer conductor 1B which is formed on the first lower layer conductor 1A and is made of a metal. The second wiring layer 2 includes: a second lower layer conductor 2A which is formed on the base material 9 and contains a binder resin and a conductive member; and a second upper layer conductor 2B which is formed on the second lower layer conductor 2A and is made of a metal. |
