发明名称 |
Contact Pads with Sidewall Spacers and Method of Making Contact Pads with Sidewall Spacers |
摘要 |
A chip contact pad and a method of making a chip contact pad are disclosed. An embodiment of the present invention includes forming a plurality of contact pads over a workpiece, each contact pad having lower sidewalls and upper sidewalls and reducing a lower width of each contact pad so that an upper width of each contact pad is larger than the lower width. The method further includes forming a photoresist over the plurality of contact pads and removing portions of the photoresist thereby forming sidewall spacers along the lower sidewalls. |
申请公布号 |
US2014048941(A1) |
申请公布日期 |
2014.02.20 |
申请号 |
US201213587809 |
申请日期 |
2012.08.16 |
申请人 |
GATTERBAUER JOHANN;WEIDGANS BERNHARD;INFINEON TECHNOLOGIES AG |
发明人 |
GATTERBAUER JOHANN;WEIDGANS BERNHARD |
分类号 |
H01L23/485;H01L21/50;H01L21/768 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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