| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique that enables a manufacturing of a sensor having excellent detection sensitivity even with a downsized dimension in an entire device.SOLUTION: The present invention is embodied as a movable body to be formed on a substrate. The movable body comprises: a first frame body; a second frame body that mutually faces the first frame body, and is arranged so as to be partially or completely overlapped with each other; a joint part that is connected to the first frame body via a first spring part, and is connected to the second frame body via a second spring part; and a fixture part that is connected to the joint part via a third spring part, and is fixed to the substrate. The first spring part, the second spring part, and the third spring part have a spring constant in one direction extraordinarily lower than a spring constant in the other direction, and substantially allow for a relative displacement only in the one direction. The direction in which the first spring part, the second spring part, and the third spring part allow for the relative displacement is mutually orthogonal. |
