METHOD FOR PRODUCING PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for producing a printed circuit board that may improve a yield of a product by preventing an insulation failure and a bridge defect of an electroless Ni/Au process in last production step.SOLUTION: The method for producing a printed circuit board of the present invention comprises steps of: applying a catalyst solution 40 containing a copper salt and an iodine compound on a surface of a substrate 10, treating the surface of the substrate 10 on which the catalyst solution 40 is applied by a reductant, and immersing the substrate 10 treated with the reductant in a chemical copper plating solution to carry out an electroless copper plating; forming a circuit pattern on the surface of the electroless copper plated substrate 10 by a plating resist 30; carrying out an electroplating of copper on the surface of the substrate on which the circuit pattern is formed; and forming the circuit by peeling the plating resist 30 and etching the copper 20 film on an unnecessary portion.