| 发明名称 |
EM PROTECTED SEMICONDUCTOR DIE |
| 摘要 |
In one embodiment, a semiconductor die is formed to have sloped sidewalls. A conductor is formed on the sloped sidewalls. |
| 申请公布号 |
US2014048917(A1) |
申请公布日期 |
2014.02.20 |
| 申请号 |
US201314061153 |
申请日期 |
2013.10.23 |
| 申请人 |
SEDDON MICHAEL J.;CARNEY FRANCIS J.;GRIVNA GORDON M.;SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
发明人 |
SEDDON MICHAEL J.;CARNEY FRANCIS J.;GRIVNA GORDON M. |
| 分类号 |
H01L23/552 |
主分类号 |
H01L23/552 |
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