发明名称 |
Bonded Structures for Package and Substrate |
摘要 |
The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance. |
申请公布号 |
US2014048929(A1) |
申请公布日期 |
2014.02.20 |
申请号 |
US201213667306 |
申请日期 |
2012.11.02 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, L;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHA MING-HONG;CHUANG CHITA;CHUANG YAO-CHUN;LIU HAO-JUIN;CHIANG TSUNG-HSIEN;KUO CHEN-CHENG;CHEN CHEN-SHIEN |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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