发明名称 HEATING PLATE WITH PLANAR HEATER ZONES FOR SEMICONDUCTOR PROCESSING
摘要 An exemplary method for manufacturing a heating plate for a substrate support assembly includes forming holes in at least one sheet, printing a slurry of conductor powder, or pressing a precut metal foil, or spraying a slurry of conductor powder, on the at least one sheet to form the planar heater zones, the power supply lines, and power return lines. The holes in the at least one sheet are filled with a slurry of conductor powder to form power supply and power return vias. The sheets are then aligned, pressed, and bonded to form the heating plate.
申请公布号 US2014047705(A1) 申请公布日期 2014.02.20
申请号 US201314062216 申请日期 2013.10.24
申请人 LAM RESEARCH CORPORATION 发明人 SINGH HARMEET;GAFF KEITH;BENJAMIN NEIL;COMENDANT KEITH
分类号 H05B3/00 主分类号 H05B3/00
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