PLATING BATH COMPOSITION FOR IMMERSION PLATING OF GOLD

摘要

The present invention relates to a cyanide-free aqueous immersion-type plating bath for deposition of gold, comprising gold ions, at least one complexing agent, sulfite ions, thiosulfate ions, and at least one ureylene polymer additive. The gold layer deposited from the plating bath according to the present invention shows a lemon-yellow colour and a sufficient wettability for tin based solder materials.