| 摘要 |
Provided are a copper foil, a copper-clad laminate, a flexible circuit board, and a manufacturing method for a copper-clad laminate that, even if wiring is formed on the flexible circuit board, show outstanding durability under harsh usage conditions involving repeated flexing with a small radius of curvature. The copper foil comprises 0.001 to 0.4% by mass of manganese, with the remainder consisting of unavoidable impurities and copper, or else comprises 0.005 to 0.4% by mass of at least one element selected from the group consisting of calcium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, dysprosium, holmium, erbium, thulium, ytterbium, and yttrium, with 99.6 to 99.999% by mass of copper in the remaining portion. Preferred orientation regions, in which fundamental crystal axes (100) of the unit lattices of the copper differ in orientation by no more than 15� respectively from two orthogonal axes, one of which is in the thickness direction of the copper foil and the other of which is in a certain direction within the foil surface, constitute at least 60% of the area of the foil. This copper foil is used in the copper-clad laminate, the flexible circuit board, and the manufacturing method for a copper-clad laminate. |
