| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method capable of printing individual identification information (ID) of a device without reducing a transverse intensity of the device.SOLUTION: A wafer processing method for printing individual identification information of each device in a region corresponding to each device on a rear surface side of the wafer in which a plurality of devices are formed on a surface thereof includes the steps of: forming a resin layer by coating a resin on a rear surface of the wafer; and printing individual identification information of each device by irradiating a region corresponding to each device in the resin layer formed on the rear surface of the resin layer with a laser beam (identification information forming step). |
