| 发明名称 |
CMP POLISHING FLUID, METHOD FOR MANUFACTURING SAME, METHOD FOR MANUFACTURING COMPOSITE PARTICLE, AND METHOD FOR POLISHING BASE MATERIAL |
| 摘要 |
A CMP polishing liquid comprises water and an abrasive particle, wherein the abrasive particle comprises a composite particle having a core including a first particle, and a second particle provided on the core, the first particle contains silica, the second particle contains cerium hydroxide, and the pH of the CMP polishing liquid is equal to or lower than 9.5. |
| 申请公布号 |
US2014051250(A1) |
申请公布日期 |
2014.02.20 |
| 申请号 |
US201213981766 |
申请日期 |
2012.01.20 |
| 申请人 |
MINAMI HISATAKA;INOUE KEISUKE;KIKKAWA CHISATO;NOMURA YUTAKA;IWANO TOMOHIRO;HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
MINAMI HISATAKA;INOUE KEISUKE;KIKKAWA CHISATO;NOMURA YUTAKA;IWANO TOMOHIRO |
| 分类号 |
C09G1/02;H01L21/306 |
主分类号 |
C09G1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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