A polyether polyamide resin composition which contains 15-200 parts by mass of a filler with respect to 100 parts by mass of a polyether polyamide resin in which diamine constituting units are derived from a specific polyether diamine compound and xylylenediamine and dicarboxylic acid constituting units are derived from an α,ω-linear aliphatic dicarboxylic acid having 4-20 carbon atoms.
