| 发明名称 |
GRINDING WHEEL FOR WAFER EDGE TRIMMING |
| 摘要 |
A grinding wheel for wafer edge trimming includes a head having an open side and an abrasive end bonded around an edge of the open side of the head. The abrasive end is arranged to have multiple simultaneous contacts around a wafer edge during the wafer edge trimming. |
| 申请公布号 |
US2014051336(A1) |
申请公布日期 |
2014.02.20 |
| 申请号 |
US201213629889 |
申请日期 |
2012.09.28 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HUANG XIN-HUA;LIU PING-YIN;HSIEH YUAN-CHIH;CHAO LAN-LIN;TSAI CHIA-SHIUNG |
| 分类号 |
B24B9/00;B24B1/00;B24B1/04;B24D7/00 |
主分类号 |
B24B9/00 |
| 代理机构 |
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