SEMICONDUCTOR PACKAGE AND MANUFACTURING METHODE THEREOF

摘要

The present invention relates to a semiconductor package and a manufacturing method thereof. The technical object to be solved is to improve transmission speed and performance by directly connecting devices without an expensive interposer or PCB. Because an input/output pad can be designed by a redistribution layer without forming a separate substrate between a first and a second semiconductor device, the thickness of a package can be reduced. Therefore, high performance and miniaturization are realized.