LAMINATION PACKAGE STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a lamination package structure superior in repairability capable of increasing the resistance against impact due to connection between a lamination package and a circuit board.SOLUTION: The lamination package structure includes: a base board; a bottom package; and a top package. The bottom package includes: a first semiconductor element; plural terminal electrodes; and an insulation member sealing the first semiconductor element, which includes plural via holes corresponding to plural terminal electrodes. The top package includes: a second semiconductor element; and plural first bumps formed corresponding to the plural terminal electrodes to be stored in the plural via holes. Within the via hole, the terminal electrode and the first bump are connected via a first metal connection member. At least a part of the first metal connection member is covered by a first resin reinforced section filled in the via hole. The melting point of the first metal connection member is lower than the melting point of the first bump.