发明名称 PACKAGE CONFIGURATIONS FOR LOW EMI CIRCUITS
摘要 An electronic component includes a high voltage switching transistor encased in a package. The high voltage switching transistor comprises a source electrode, a gate electrode, and a drain electrode all on a first side of the high voltage switching transistor. The source electrode is electrically connected to a conducting structural portion of the package. Assemblies using the abovementioned transistor with another transistor can be formed, where the source of one transistor can be electrically connected to a conducting structural portion of a package containing the transistor and a drain of the second transistor is electrically connected to the second conductive structural portion of a package that houses the second transistor. Alternatively, the source of the second transistor is electrically isolated from its conductive structural portion, and the drain of the second transistor is electrically isolated from its conductive structural portion.
申请公布号 US2014048849(A1) 申请公布日期 2014.02.20
申请号 US201314063438 申请日期 2013.10.25
申请人 TRANSPHORM INC. 发明人 WU YIFENG
分类号 H01L27/02;H01L21/77 主分类号 H01L27/02
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