TREATING APPARATUS FOR SUBSTRATE AND TREATING METHOD FOR SUBSTRATE

摘要

The present invention relates to a substrate processing device comprising a processing chamber in which a processing target substrate is positioned; a discharge unit inside the processing chamber to discharge a processing medium to the substrate; a first air current module for providing a descending air current flowing inside the processing chamber from the top to the bottom; and a second airflow module for accepting the descending air current and a substrate processing method.