| 摘要 |
Provided are an apparatus for treating a substrate and a blade module that includes a first block having a first surface and a second surface facing the first surface, a second block combined with the first block to face the first surface of the first block and having a first connection path to make first media pass between the first blocks, a third block combined with the first block to face the second surface of the first block and having a second connection path to make second media pass between the first blocks, a first injection hole connected to the first connection path and located between the first block and the second block, and a second injection hole connected to the second connection path and located between the first block and the third block. |
