发明名称 COMPOSITION FOR FORMING METAL PATTERN AND METHOD FOR FORMING METAL PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a composition for forming a metal pattern, in which metal salt and a metal complex are used, and to provide a method for forming a metal pattern.SOLUTION: The composition for forming a metal pattern is prepared by mixing metal salt and/or a metal complex with a reductant. The reductant preferably includes at least one or more of ammonia, a primary amine, a secondary amine, and a tertiary amine, but the mixing may be performed with ethanol, water and the like. A metal pattern (conductive pattern) is formed by printing with the composition for forming a metal pattern on a substrate and radiating a light pulse thereto.
申请公布号 JP2014031577(A) 申请公布日期 2014.02.20
申请号 JP20130144585 申请日期 2013.07.10
申请人 OSAKA UNIV;SHOWA DENKO KK 发明人 SUGANUMA KATSUAKI;ATAGI MASAYA;SUGAWARA TORU;ARAKI TEPPEI;UCHIDA HIROSHI;SHINOZAKI KENJI
分类号 C23C18/34;C23C18/40;H05K3/10 主分类号 C23C18/34
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