| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method that can suppress generation of sludge and can efficiently supply an Sn component.SOLUTION: A target substrate 2 and an insoluble anode electrode 3 are placed in a plating tank 1 that stores an Sn-containing plating solution. The target substrate 2 is plated, and at the same time, the plating solution is drawn from the tank and then mixed with metal tin powder to produce a mixed plating solution, which is supplied to the insoluble anode electrode 3. Oxygen generated from the insoluble anode electrode 3 is brought into contact with the metal tin powder to produce Sn ions. |
