| 摘要 |
<p>A panel bonding device, according to the present invention, comprises: a first panel mounting plate having a first mounting surface on which a first panel is mounted; a second panel mounting plate which has a second mounting surface on which a second panel is mounted, and which is positioned to be higher than the first panel mounting plate; a first rotating apparatus for rotating the second panel mounting plate centered around a first rotation center line that is parallel to the ground; a second rotating apparatus for rotating the second panel mounting plate centered around a second rotation center line which crosses the first rotation center line; and an elevating device for elevating the first panel mounting plate and/or the second panel mounting plates so as to bond the first panel and the second panel. The panel bonding device, according to the present invention, can bond two panels after stably and precisely adjusting positions of the two panels to be bonded before bonding the two panels.</p> |
