SILICON INGOT CUTTING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a silicon ingot cutting apparatus capable of more reliably preventing edge chipping and cracking which occur at the time of cutting a silicon ingot.SOLUTION: A silicon ingot cutting apparatus 100 cuts a columnar silicon ingot 1 placed on a slicing table 2 into tabular blocks 11 with the use of a cutting blade 3. The silicon ingot cutting apparatus 100 has pressing means 5 which presses, from the opposite side of the slicing table 2, the silicon ingot 1 and the tabular blocks 11 to be cut from the silicon ingot 1, when the cutting blade 3 cuts a cutting end portion of the silicon ingot 1.