| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a small chip area.SOLUTION: In a semiconductor chip 1, an annular seal ring SR1 is formed along the outer periphery of a semiconductor substrate 2, and an annular seal ring SR2 is formed along the inner side of the seal ring SR1. The seal rings SR1 and SR2 are used as a power-supply line VL1 and a ground line GL1 for an internal circuit 3, respectively. For this reason, the chip area can be reduced as compared to a conventional configuration in which the power-supply line VL1 and the ground line GL1 are separately provided from the seal rings SR. |
