| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a through port-containing substrate having a through port having a shape substantially perpendicular to the substrate, which method can suppress expansion of an opening of the through port by notching.SOLUTION: A method for manufacturing a through port-containing substrate, in which a through port is formed by performing dry etching from a second surface on a side opposite to a first surface of the substrate to the first surface, includes the steps of (a) forming a groove around an area forming the through port on the first surface of the substrate, (b) forming an etching stop layer in the area forming the through port and in the groove on the first surface of the substrate, and (c) performing the dry etching from the second surface, to form the through port in this order. |
